Alphawave Semi is highlighting its latest high-performance connectivity and compute silicon at ECOC 2025 in Copenhagen, with demonstrations spanning SerDes, chiplets, DSPs, and die-to-die interconnects. The company’s portfolio targets hyperscaler AI and cloud infrastructure, extending high-speed communication over both copper and optical channels.
The showcase includes 224G PAM4 SerDes, 224G XLR IP subsystem solutions, and 1.6T multi-standard I/O chiplets. Alphawave is also presenting its 36G UCIe die-to-die (D2D) IP subsystem on TSMC 3nm, supporting up to 64 Gbps for optical I/O chiplets. On the DSP front, the company is demonstrating Cu-Wave PAM4 DSP for Active Electrical Cables (AEC), O-Wave PAM4 DSP for optical retimer and gearbox transceivers, and Co-Wave Coherent-lite DSP for optical transceivers. Interoperability demos are being featured with PCIe and Ethernet chiplets at OIF and Ethernet Alliance booths.
Additional highlights include an optical PCIe subsystem for interoperability testing and multi-vendor ecosystem collaborations showcasing 224G and optical-aware PCIe. Alphawave positions these technologies as silicon-proven, production-ready solutions for scaling AI, cloud, and HPC workloads.
• 224G PAM4 Electrical SerDes and 224G XLR IP subsystem
• 1.6T I/O chiplets for PCIe and Ethernet
• 36G UCIe D2D IP subsystem on TSMC 3nm (scalable to 64G)
• Optical PCIe subsystem with live interoperability testing
• Cu-Wave, O-Wave, and Co-Wave DSPs for copper and optical deployments
• Multi-vendor interoperability demonstrations at OIF and Ethernet Alliance booths
“Our mission is to accelerate the critical data infrastructure at the heart of our digital world,” said Alphawave Semi.
🌐 Analysis: SerDes evolution remains a focal point for enabling AI-scale data movement, with 224G signaling setting the stage for next-generation Ethernet and optical I/O. Copper links, especially with AECs, remain relevant for shorter-reach connections, but optics is steadily advancing into rack-to-rack and die-to-die domains. Alphawave’s UCIe D2D demonstration on 3nm aligns with industry momentum toward chiplet-based architectures and optical interconnect readiness. The company’s pending acquisition—still moving through regulatory review—adds another layer of strategic importance as hyperscaler customers demand integrated silicon roadmaps spanning electrical and optical. Competitors such as Broadcom, Marvell, and Synopsys are also advancing SerDes and D2D IP portfolios, signaling an intense race to define connectivity in AI data centers.
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