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Artimi Secures $14 Million for UWB Chips

Artimi., a start-up based in Burlingame, California with R&D in Cambridge, UK, announced $14 million in Series A funding for its development of Ultra Wideband (UWB) silicon solutions. Artimi is developing a low cost, single chip solution that aims to extend the range and boost the performance of UWB connectivity. Artimi’s UWB chips could be used for applications such as interconnecting flat panel displays, DVD, DVR and other multimedia devices. The company participates in standard-setting industry bodies, including IEEE 802.15 working groups and the Multi-Band OFDM Alliance (MBOA).

Index Ventures co-led the round with Accel Partners and Amadeus Capital Partners Ltd and investment from Oak Investment Partners. http://www.artimi.com

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