Baya Systems and Semidynamics have announced a collaboration to accelerate the development of RISC-V-based System-on-Chip (SoC) platforms optimized for AI, machine learning (ML), and high-performance computing (HPC). By integrating Semidynamics’ high-bandwidth RISC-V processor IP with Baya Systems’ WeaveIP™ Network on Chip (NoC) technology, the partnership aims to enhance data transport efficiency and scalability.
This collaboration addresses the growing demand for computational platforms capable of balancing processing power with efficient data movement, particularly for AI, ML, and HPC workloads in data centers, automotive applications, infrastructure, and edge IoT.
Key highlights of the collaboration include:
- Integration of RISC-V Cores and NoC Technology: Semidynamics’ 64-bit RISC-V processor IP, known for memory bandwidth and configurability, is combined with Baya Systems’ WeaveIP NoC, enabling ultra-efficient, high-bandwidth data transport.
- Accelerated SoC Development: The pre-integration of Semidynamics and Baya Systems’ technologies reduces development timelines, eliminating data transport bottlenecks.
- Scalable, Chiplet-Ready Solutions: Baya’s NoC technology supports extreme scalability, complementing Semidynamics’ flexible architectures for next-generation AI and HPC applications.
- Software-Driven Optimization: Baya Systems’ WeaverPro™ platform ensures system-level optimization, improving performance metrics for real-world workloads.
- Industry Event Showcase: Both companies will showcase their innovations at Embedded World 2025 in Nuremberg, Germany, from March 11-13.
Baya Systems recently secured Series B funding, reinforcing its position as a leader in semiconductor innovation. With backing from investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital, Baya is expanding its development of high-performance, modular semiconductor systems. The company’s chiplet-ready NoC solutions enable scalable, power-efficient computing for AI, ML, and HPC applications, positioning Baya as a key enabler of the next wave of intelligent compute infrastructure.
“Our customers need high-performance compute that doesn’t get bottlenecked by inefficient data transport,” said Roger Espasa, CEO of Semidynamics. “Partnering to pre-integrate with Baya Systems’ WeaveIP™ technology accelerates development timelines for our mutual customers, eliminating this bottleneck and enabling a new level of performance for AI and HPC applications.”