Celestica has introduced two new 1.6TbE data center switches—the DS6000 and DS6001—designed for AI and machine learning workloads requiring extreme bandwidth and flexibility. Based on Broadcom’s Tomahawk 6 (TH6) switch silicon, both platforms deliver 102.4 Tbps of switching capacity, doubling the performance of Celestica’s previous 800 G solutions. The company plans to contribute specifications for both models to the Open Compute Project (OCP) and list them on the OCP Marketplace with OCP Inspired recognition.
The DS6000 is a 3RU, 64-port, air-cooled switch supporting 50/100/200/400/800 GbE speeds through OSFP interfaces, with 224 G SerDes lanes and options for forward or reverse airflow. The DS6001, in contrast, fits a 21-inch OCP ORv3 rack and employs hybrid air-liquid cooling in a compact 2U chassis to enhance energy efficiency. Both switches support open-source network operating systems, including Celestica Solutions for SONiC, ensuring interoperability across large-scale data center and edge deployments.
The new switches will debut at the OCP Global Summit 2025 in San Jose next week, underscoring Celestica’s commitment to open networking and AI infrastructure optimization. The Broadcom TH6 chipset enables advanced features like Cognitive Routing 2.0 and support for both scale-up and scale-out AI architectures.
• DS6000: 3RU, 64 × 1.6 TbE OSFP ports, air-cooled
• DS6001: 2U, 64 × 1.6 TbE ports, hybrid cooled for OCP ORv3 racks
• Both switches: 102.4 Tbps capacity, 224 G SerDes, SONiC support
• Designed for AI/ML clusters, hyperscaler and enterprise deployments
• OCP Inspired contribution planned; to be displayed at OCP Global Summit 2025
“The introduction of our new 1.6T switches marks a significant milestone for Celestica and our customers,” said Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering at Celestica. “The DS6000 and DS6001 represent a new era in high-performance networking, doubling the switching capacity of our current offerings and designed specifically to meet the demands of AI/ML cluster applications.”
🌐 Analysis:
Celestica’s DS6000 and DS6001 highlight a growing shift toward 1.6 TbE and 102.4 Tbps platforms optimized for AI workloads—mirroring similar launches from Broadcom, Arista, Cisco, and Dell this year. The use of Broadcom’s Tomahawk 6 silicon positions Celestica firmly in the 224 G SerDes generation, crucial for high-density GPU and accelerator interconnects. The addition of hybrid cooling and SONiC support also aligns with broader OCP trends emphasizing open, energy-efficient designs for next-gen AI data centers.
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