The U.S. Department of Commerce has awarded HP Inc. up to $53 million in direct funding under the CHIPS Incentives Program to support the expansion and modernization of HP’s semiconductor facility in Corvallis, Oregon. The investment will enhance HP’s lab-to-fab ecosystem, a key part of its 48-year presence in Oregon, spanning from R&D to full-scale commercial manufacturing. The funding, disbursed based on project milestones, aims to strengthen domestic semiconductor production and technological innovation in the U.S.
The CHIPS funding will support the manufacturing of silicon devices essential for life sciences lab equipment, including tools for drug discovery, single-cell research, and cell line development. These devices, leveraging HP’s microfluidics and microelectromechanical systems (MEMS) expertise, will improve speed and precision in life sciences R&D. The expansion is expected to create and sustain nearly 150 construction jobs and over 100 manufacturing jobs.
• $53 Million Award: To expand and modernize HP’s semiconductor facility in Corvallis, Oregon.
• Lab-to-Fab Ecosystem: Supports both R&D and commercial semiconductor manufacturing.
• Advanced Technologies: Focus on MEMS and microfluidics for life sciences applications.
• Job Creation: Nearly 250 jobs, including construction and manufacturing roles.
• Milestone-Based Disbursement: Funds released as HP completes project benchmarks.
HP CEO Enrique Lores stated: “This CHIPS grant will bolster U.S. semiconductor innovation and strengthen our competitiveness in critical industries like life sciences.”