Marvell will highlight its interconnect portfolio for AI infrastructure at ECOC 2025 in Copenhagen, showcasing innovations across optics, silicon, and memory aimed at scale-up and scale-out data center deployments. The company said the rise of generative AI and large-scale models is driving demand for high-bandwidth, power-efficient interconnects capable of supporting massive hyperscale clusters across racks, campuses, and distributed sites.
The demonstrations at booth #C4134 will feature Marvell’s full-stack approach, integrating chiplet-based architectures, optical platforms, and advanced DSPs. Key solutions on display include its 200G/lane co-packaged optics (CPO) platform for AI scale-up within racks, the COLORZ 800G ZR/ZR+ coherent pluggables that extend data center interconnects up to 2,000 km, and the Ara 1.6T 3nm PAM4 DSP with 200G per lambda for AI scale-out across rows and data halls. These technologies aim to reduce latency, cut power consumption, and simplify deployment at cloud scale.
Marvell experts will also present technical sessions during ECOC25, covering market trends and product developments in coherent DSPs, co-packaged optics, and rack-scale connectivity. The company emphasized its goal of enabling faster, more efficient interconnect performance to meet the demands of accelerated AI infrastructure.
• Co-packaged optics (200G/lane) for rack-level AI scale-up
• COLORZ 800G ZR/ZR+ coherent pluggables for multi-site AI clusters up to 2,000 km
• Ara 1.6T PAM4 DSP with 200G per channel on TSMC 3nm process for AI scale-out fabrics
• ECOC presentations on coherent DSPs, CPO, and rack-scale optical/copper connectivity
“Our interconnect technologies are designed to deliver the bandwidth and efficiency needed to power AI infrastructure at scale,” said Bo Zhang, senior principal engineer at Marvell.
🌐 Analysis
🌐 Analysis: ECOC has become the central stage for the optical and interconnect industry, where vendors align their portfolios to the demands of AI-scale data centers. The 2025 event in Copenhagen highlights a consistent set of themes across the announcements we’ve covered: the rise of coherent pluggables for both short-reach and DCI use cases, the push toward 200G/lambda and 1.6T architectures, and the emergence of co-packaged optics as hyperscalers evaluate rack- and row-scale connectivity strategies. Another recurring focus is interoperability, with OIF-led demonstrations validating multi-vendor environments. Together, these developments point to a rapidly converging ecosystem where optics, DSP silicon, and packaging are co-optimized to meet the power and scale requirements of next-generation AI infrastructure.
🌐 We’re tracking the latest developments at ECOC25 in Copenhagen. Follow our ongoing coverage at https://convergedigest.com/tag/ecoc25/