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Foxconn Interconnect Technology demos 400G BiDi

Foxconn Interconnect Technology (FIT) will demonstrate its 400 Gbps Bi-directional (BiDi) QSFP-DD multi-mode fiber (MMF) transceiver module for 400 Gigabit Ethernet Applications.

The module is designed to facilitate an easy upgrade path from 100 Gbps to 400 Gbps by reusing existing MPO fiber cable infrastructure used in 40G SR4 QSFP+ and 100G SR4 QSFP28 deployment with 8-fibers ribbon cable. The 400G BiDi modules support link distances up to 70m OM3 and 100m OM4.

FIT cited the following advantages for the 400G BiDi transceiver compared to alternative solutions, including:

“The 2 million 40G and 100G BiDi transceivers we have shipped to date demonstrate the success and market acceptance of these optical solutions enabling customers to realize further cost savings by reusing their existing OM3 and OM4 MMF cable infrastructures. The new 400G BiDi transceiver module leverages proven FIT BiDi technology and builds upon that success story by offering a higher speed product for link distances below 100 meters for hyperscale data centers, enterprise, and fabric interconnects of 5G wireless infrastructures,” said Adam Carter, Chief Commercial Officer in FIT’s Fiber Optics Communications Business.

https://www.foit-foxconn.com

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