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GlobalFoundries Partners with Singapore’s A*STAR of Packaging R&D

GlobalFoundries (GF) has signed a Memorandum of Understanding with Singapore’s Agency for Science, Technology and Research (ASTAR) to accelerate research and development in advanced semiconductor packaging. The collaboration will grant GF access to ASTAR’s R&D infrastructure and technical expertise, while GF will contribute critical equipment to support A*STAR’s research initiatives. The agreement is part of GF’s broader effort to expand its packaging capabilities to meet growing global demand for AI, high-performance computing, and next-generation communication technologies.

The partnership aims to fast-track GF’s advanced packaging roadmap and scale the development and deployment of compact, energy-efficient solutions. These will be manufactured, packaged, and tested at GF’s Singapore facility, enhancing its ability to offer integrated chip production services. Workforce development is also a key component of the collaboration, with both organizations committed to upskilling semiconductor professionals and developing local talent for the advanced packaging sector.

“With a robust semiconductor ecosystem and strong R&D support from the government and institutions like ASTAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, Chief Technology Officer at GlobalFoundries. Terence Gan, Executive Director at ASTAR’s Institute of Microelectronics, added, “A*STAR looks forward to working closely with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies and become leaders in this domain.”

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