IBM and ARM Sign Agreement for Mobile Electronics

IBM and ARM announced an deal to extend their collaboration to enable the rapid development of next generation mobile products optimized for performance and power efficiency. The collaboration combines optimized physical and processor IP by ARM tuned to IBM’s advanced manufacturing process down to 14nm; providing streamlined development and earlier introduction of advanced consumer electronics into the marketplace. The companies said this partnership helps minimize the risk and barriers to migrating to smaller geometries while enabling optimized density, performance, power and yield in advanced SoC designs; accelerating the introduction of advanced electronics into the marketplace.

“The ARM Cortex processor family has become the leadership platform for the majority of smart phones and many other emerging mobile devices,” said Michael Cadigan, general manager, IBM Microelectronics. “We plan to continue working closely with ARM and our foundry customers to speed the momentum of ARM technology by delivering highly advanced, low-power semiconductor technology for a variety of new communications and computing devices.”http://www.ibm.com http://www.arm.com/