In his first major keynote as CEO of Intel, Lip-Bu Tan took the stage at the Intel Direct event in San Jose to outline a clear and ambitious vision for the company’s foundry transformation. Emphasizing the trillion-dollar opportunity driven by AI, Tan reaffirmed Intel’s commitment to being the only company delivering leading-edge semiconductor design, process technology, and advanced packaging—all within the U.S. He underscored the importance of embracing industry-standard EDA tools, building a broad ecosystem, and transforming Intel Foundry into a service business defined by trust, speed, and co-innovation.
Tan was joined by EDA and design leaders from Synopsys, Cadence, Siemens EDA, and PDF Solutions, all of whom highlighted their partnerships with Intel in developing the IP, flows, and enablement infrastructure necessary to scale nodes like 18A and 14A. Together, they emphasized that enabling rapid design cycles, predictable yields, and advanced packaging (including EMIB and backside power) is essential to support customer success in the AI and HPC markets. Intel also committed to reducing design complexity, fostering interoperability, and accelerating time-to-market through collaboration and ecosystem trust.
- Lip-Bu Tan confirmed Intel’s commitment to building a customer-first, globally competitive foundry.
- Intel is doubling down on 18A and 14A, both of which feature RibbonFET and backside power for AI and HPC workloads.
- Intel’s advanced packaging strategy—EMIB, Foveros, and TSV—is central to supporting chiplet-based, high-bandwidth designs.
- Intel is embracing industry-standard EDA tools and flows, partnering with Synopsys, Cadence, Siemens EDA, and PDF Solutions.
- Synopsys noted that design cycles on Intel 18A have reached parity with industry-standard nodes.
- Cadence emphasized the use of AI in chip design and Intel’s critical role in co-packaged systems and infrastructure innovation.
- Siemens EDA stressed the importance of DFM, manufacturing predictability, and Intel’s unique position in combining design and packaging.
- PDF Solutions described deep co-optimization of design and manufacturing data, enabling faster time-to-yield and production analytics.
- Intel launched new initiatives to simplify ecosystem engagement and enable turnkey manufacturing workflows.
“This is truly a service business, built on trust. Our job is to make it easier for customers to succeed—and to earn their business every single day,” said Lip-Bu Tan, CEO of Intel.