Intel Shows Low-Cost Atom Chipset, LTE-A Modem, Mobile Innovations

Intel unveiled several new mobile platforms at Mobile World Congress, including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets and a global LTE solution.

The Intel Atom x3 processor series (formerly code-named “SoFIA”) is Intel’s first integrated communications platform for entry and value devices.  It combines 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity.  The SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset.

The rollout includes the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) — the first 14nm Intel Atom SoCs. These offer 64-bit support for Windows and Android, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity.

Intel’s third-generation LTE modem will support LTE Advanced Category 10 service. It offers 3x carrier aggregation and download speeds up to 450 Mbps. Intel also cited improvements in size and power efficiency.  At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Some other mobile innovations from Intel include “RealSense” depth sensing technology, wireless charging and “True Key” by Intel Security.

In addition, Intel highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.