“Innovation and industry transformation are happening more rapidly than ever before, which play to Intel’s strengths. We have the manufacturing technology leadership and architectural tools in place to push further into lower power regimes. We plan to shape and lead in all areas of computing,” state
d Intel CEO Brian Krzanich in a keynote address at this year’s Intel Developer Forum 2013.
Some highlights of the speech:
- Intel is now shipping a multimode 4G chip, the Intel XMM 7160 modem, which is one of the world’s smallest and lowest-power multimode-multiband solutions for global LTE roaming. The current version is data-only with 3G voice. Support for Voice-over-LTE is expected by the end of the year.
- The company’s next-generation LTE product, the Intel XMM 7260 modem, is expected to ship in 2014. It will deliver LTE-Advanced features, such as carrier aggregation, timed with future advanced 4G network deployments.
- “Bay Trail,” Intel’s first 22nm system-on-a-chip (SoC) for mobile devices. will be introduced this week. “Bay Trail” is based on the company’s new low-power, high-performance Silvermont microarchitecture, which will power a range of Android and Windows designs, most notably tablets and 2 in 1 devices.
- A new Intel Quark processor family is being introduced targeting segments from the industrial Internet-of-Things to wearable computing. It is designed for applications where lower power and size take priority over higher performance. The first form-factor reference boards will sample in Q4.
- Intel demonstrated a smartphone platform featuring both the Intel XMM 7160 LTE solution and Intel’s next-generation Intel Atom SoC for 2014 smartphones and tablets codenamed “Merrifield.” Based on the Silvermont microarchitecture, “Merrifield” will deliver increased performance, power-efficiency and battery life over Intel’s current-generation offering.
A video of the keynote is online.