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Lantiq Samples 65nm VDSL2 CO Chipset with Line Bonding

Lantiq unveiled its latest generation 65nm chipset for central office linecards supporting the global VDSL2 and ADSL/2/2+ standards. The design can drive data rates up to 150 Mbps/downstream and 100 Mbps/upstream on a single line.

The new VINAX V3 chipset, which boasts the smallest package size and highest channel count, gives network equipment vendors a single solution to meet carrier requirements for all xDSL deployments. Sampling is underway. Some key features include:

Lantiq noted that its VINAX V3 also supports line bonding techniques at chip and linecard levels that boost data-rate or data-reach for home and business users and support mobile backhaul applications with up to 500 Mbps symmetrical data rates. The chipset is also ready to support full System Vectoring, a VDSL2 enhancement that will reduce crosstalk in dense cable bundles.
http://www.lantiq.com/VINAX-V3

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