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LiquidStack Brings High Density Direct-to-Chip Cooling

LiquidStack has introduced the GigaModular™ CDU, a scalable coolant distribution unit designed to meet the rising demand for high-density, direct-to-chip liquid cooling in AI and cloud data centers. Engineered for flexibility and performance, the GigaModular supports up to 10MW of heat load with a pay-as-you-grow design that simplifies deployment and future expansion.

Targeting next-generation compute platforms like NVIDIA’s B300 and GB300, the GigaModular addresses the escalating heat densities that are quickly surpassing 120kW per rack, with projections of up to 600kW by 2027. The unit features a modular pump and control architecture, centralized instrumentation for precise monitoring, and a compact footprint that allows for wall-adjacent installation. Key components include high-efficiency IE5 pumps, dual 25μm strainers for component protection, and a front-access design to streamline servicing.

The GigaModular CDU is offered in configurations ranging from 2.5MW to 10MW and can be delivered as a pre-integrated skid-mounted system or in cabinet modules for on-site assembly. Production will begin at LiquidStack’s facility in Carrollton, Texas, with customer quoting available starting September 2025.

“With up to 10MW of cooling capacity at N, N+1, or N+2, the GigaModular is a platform like no other—we designed it to be the only CDU our customers will ever need,” said Joe Capes, CEO of LiquidStack.

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