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MACOM Unveils $345M Plan to Modernize Semiconductor Facilities

MACOM announced a strategic capital investment plan of up to $345 million to modernize its semiconductor wafer fabrication facilities in Massachusetts and North Carolina. The five-year investment initiative aims to strengthen U.S. semiconductor manufacturing and aligns with the CHIPS and Science Act. MACOM has entered a preliminary, non-binding agreement with the CHIPS Program Office for up to $70 million in direct federal funding, with additional support bringing total federal and state funding to $180 million. The remaining $165 million will be self-funded from MACOM’s operating cash flow.

The investment will enhance MACOM’s RF, microwave, and millimeter-wave semiconductor manufacturing capabilities, supporting defense, telecommunications, and data center markets. The Massachusetts facility will see cleanroom expansion, modernization of its 100mm production lines, and the installation of a 150mm GaN-on-SiC production line. The North Carolina facility will also expand cleanrooms and introduce 150mm wafer capabilities along with advanced MOCVD epitaxial growth technology. Both sites will receive infrastructure upgrades, including HVAC, water, and power systems improvements.

Investment Amount: Up to $345 million over five years.

Federal & State Support: $180 million via CHIPS Act, Massachusetts Technology Collaborative, and other incentives.

Self-Funding: $165 million from MACOM’s operating cash flow.

Facility Upgrades: Cleanroom expansions, advanced 150mm GaN-on-SiC production lines, infrastructure modernization.

Technology Focus: RF, microwave, and millimeter-wave semiconductors.

Key Markets: Defense, telecommunications, data centers.

“This plan will strengthen MACOM’s domestic semiconductor manufacturing capabilities, accelerate our growth strategy, and enable us to better service our customers with leading technologies,” said Stephen G. Daly, President and CEO of MACOM.

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