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Microsoft Previews Custom Silicon for Azure Infrastructure

Microsoft previewed two new custom chips at its Ignite conference, expanding its in-house silicon portfolio to enhance Azure’s efficiency, security, and performance. The new additions, the Azure Boost DPU and the Azure Integrated HSM, are designed to accelerate storage workloads and bolster cryptographic security, respectively. These chips complement Microsoft’s existing silicon lineup, including the Cobalt SoC and the Maia AI Accelerator, signaling the company’s commitment to optimizing its cloud infrastructure.

The Azure Boost DPU focuses on data-centric workloads by accelerating storage, networking, and other compute-heavy operations. Microsoft claims that future Azure servers equipped with this chip will deliver 4x performance improvements and consume 3x less power for cloud storage workloads compared to current setups. While no specific availability timeline was disclosed, deployments are anticipated to begin within the next year, in line with similar past rollouts.

The Azure Integrated HSM addresses the growing demand for secure cloud environments. This hardware security module (HSM) is designed to meet FIPS 140-3 Level 3 standards, providing a robust layer of cryptographic security for tasks like encryption and key management. The chip includes specialized hardware accelerators for high-performance cryptographic operations and is slated for deployment in all new Azure servers starting next year.

Azure Boost DPU

Purpose: Storage and data-centric workload acceleration. Azure Boost DPU integrates hardware and software in a co-designed system with a lightweight data-flow operating system, delivering significantly improved performance, power efficiency, and platform agility over traditional architectures. It enables cloud storage workloads to operate with three times less power and four times the performance of CPUs. The DPU’s custom application layer incorporates advanced data compression, protection, and cryptography engines, enhancing security and reliability for modern cloud systems.

Performance: 4x faster, 3x more power-efficient for cloud storage workloads.

Timeline: Expected deployment within the next year.

Azure Integrated HSM

• Purpose: Cryptographic security and key management.

• Features: Meets FIPS 140-3 Level 3, includes hardware cryptographic accelerators.

• Timeline: Deployment in all new Azure servers starting in 2025.

Existing Chips

Cobalt SoC: Arm-based, optimized for general-purpose workloads.

Maia AI Accelerator: Supports large language model training and inference, including OpenAI systems.

“These new chips demonstrate Microsoft’s dedication to building a cloud infrastructure tailored for efficiency, security, and scalability,” the company noted during the event.

In addition, Microsoft highlighted ongoing work with

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