Molex announced it has expanded its zSFP+ Interconnect System to support 56 Gbit/s PAM4 channels in a stacked 2 x N port configuration, allowing next-generation Ethernet and Fibre Channel applications to receive improved signal integrity.
Molex claims the product is the first of its kind on the market, enabling OEMs requiring high-density interconnect applications now to utilise channels with individual lane data rates up to 56 Gbit/s PAM4. The updated Molex product also maintains a low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment as provided by the previous generation zSFP+ interconnect system.
Molex has also developed a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ interconnect system. The advanced terminal is designed to provide superior signal integrity for 56 Gbit/s PAM4 applications. The system also allows users to merge standard cables and modules with the increased data-rate accepted.
The new zSFP+ interconnect system targets applications in cellular infrastructure, telecom equipment, switches, data networking servers and storage systems.
http://www.molex.com/molex/news/ShowArticles.action
- * Recently, the SFP-DD MSA Group, which includes Molex as a founding member, announced plans to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface. The MSA plan to develop operating parameters, signal transmission speed goals and protocols for the SFP-DD interface, which expands on the SFP pluggable form factor.
- The SFP interface’s single electrical lane operates at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4, with the new SFP-DD electrical interfaces designed to support 2 lanes operating at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4 per lane to support 50/112 Gbit/s aggregate bandwidth