Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption.
Dan Pitt, President of Palo Alto Innovation Advisors, previews a panel discussion on Sunday, March 24, 16:00 – 18:30, featuring:
- Alex Chikhaoui, X-Celeprint, Ireland
- Ivan Huang, Avicena Tech, United States
- Michael Lebby, Lightwave Logic, United States
- Sylvie Menezo, Scintil, France
- Edward Preisler, Tower Semiconductor, United States
- Jing Zhang, IMEC AND Ghent University, Belgium
- Mian Zhang, Hyperlight, United States
Have a tech update that you want to brief us on? Contact info@nextgeninfra.io!