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#OFC25 Video: Co-Packaged Optics Gains Momentum

GlobalFoundries (GF) is at the forefront of advancing silicon photonics, a technology poised to revolutionize data center and high-performance computing interconnects. Their GF Fotonix™ platform integrates photonic, radio frequency (RF), and complementary metal-oxide semiconductor (CMOS) components onto a single 300mm wafer, enabling monolithic electro-optical integration. This integration facilitates high-bandwidth, low-power optical interconnects.

Kevin Soukup, SVP and GM, Silicon Photonics from GlobalFoundries explains:

– Monolithic wafer technology integrates CMOS RF and silicon photonics devices on a single chip, enabling both pluggable and co-packaged optical solutions

– Two-sided electro-optical testing ensures optical engines function properly before integration with expensive GPU systems

– Detachable fiber connections provide essential reliability and serviceability for data center

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