OIF members have approved the CEI (Common Electrical I/O) 224G Development Project, the next electrical data rate beyond 112 Gbps.
The expected result will be a technical white paper summarizing a consensus-based body of knowledge which will then enable several project starts for next generation CEI clauses addressing specific reaches and architectures.
OIF’s recent quarterly virtual meeting also resulted in a wrap-up of the “Co-packaging of Optics with ASICs” members-only workshop and a readout of the results of the public Optical Module Management Interface Survey.
OIF held a “Co-packaging of Optics with ASICs” workshop on July 20th for OIF members. The workshop explored the various challenges of co-packaging of optics and identified opportunities for industry collaboration. Presenting companies included Applied Optoelectronics, Inc., Facebook, Inphi, Intel, Keysight Technologies, Microsoft, Ranovus, Senko Advanced Components, Inc. and TE Connectivity. Based on the success of the member workshop and increasing interest in the topic industry-wide, OIF is planning a public workshop on co-packaging of optics. Details and registration will be available soon.
OIF recently conducted a public industry survey designed to determine how the Coherent Common Management Interface Specification Implementation Agreement is viewed by the industry and the level of industry alignment and support for further standardization of optical module management. Results of the survey were presented on a public webinar on July 30 and recapped during the Q3 meeting. Click HERE to download the survey results. Survey results are posted here: https://www.oiforum.com/wp-content/uploads/OIF_Management_Survey_results_V7.pdf