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Video: Industry-Wide Collaboration on 448G

Broadcom’s Cathy Liu Urges Industry-Wide Collaboration to Tackle 400G Electrical Challenges

At the recent OIF 448G technical session, Cathy Liu, SerDes architect at Broadcom and Vice President of the OIF, emphasized the need for a new model of cross-industry collaboration to address the growing challenges of 400G electrical interfaces in AI-scale data center systems. Liu noted that while earlier generations like 100G and 200G were managed largely through independent vendor optimizations, the leap to 400G demands joint effort across the entire ecosystem—from hyperscalers to chip and connector vendors.

Reflecting on insights from Meta, Google, and leading system vendors like Juniper and Cisco, Liu explained that the current approach of working in silos is no longer sufficient. The industry must adopt joint optimization strategies to overcome issues such as signal integrity, power constraints, and channel feasibility. “The traditional way doesn’t work anymore,” Liu said. “We need end users, equipment vendors, connector suppliers, chip designers, and SerDes IP developers to work together.”

From her SerDes perspective, Liu identified the electrical channel as the most pressing bottleneck in enabling 400G. She called on the community to model real-world channel data and evaluate trade-offs in modulation formats such as PAM4, PAM6, and PAM8. Achieving the right balance between performance and power efficiency will require a holistic, co-optimized design approach that spans multiple layers of the system stack.

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