Qualcomm introduced its third-generation 5G smartphone solution – its Snapdragon X60 Modem-RF System with support across a mix of frequency bands (mmWave, sub-6 GHz including low bands), band types (5G FDD and TDD), and deployment modes (SA and NSA).
Highlights of the Snapdragon X60:
- 5nm process node for the 5G baseband chip packs higher power efficiency into a smaller footprint.
- Support for 5G FDD-TDD sub-6 carrier aggregation helps networks maximize their spectrum resources for coverage and peak speeds.
- Support for 5G TDD-TDD sub-6 carrier aggregation allows SA networks to double peak speeds (compared to Snapdragon X55).
- mmWave-sub6 aggregation unlocks a gamut of options for operators to achieve the best of both worlds – network capacity and coverage.
- The new Qualcomm QTM535 mmWave antenna module introduced with Snapdragon X60 is smaller than the previous generation and allows new, sleek mmWave smartphone designs, with improved mmWave performance.