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Rain Tree Photonics Launches 200G/Lane Silicon Photonics 

Rain Tree Photonics (RTP) has launched its 200G/lane photonic integrated circuit (PIC) product family, targeting optical interconnects for AI clusters and hyperscale data centers. The new PICs are built on the company’s RAIN-200 platform, which features high-bandwidth germanium photodetectors, silicon Mach-Zehnder modulators, and ultra-low-loss waveguide technology to enable advanced use cases, including 1×8 laser splitting. RTP is now sampling 200G/lane PICs for 800G-DR4 and 1.6T-DR8 applications, with additional variants—800G-2xFR2 and 1.6T-2xFR4—slated for release in the second half of 2025.

The RAIN-200 platform offers a range of packaging options for tighter electronic-photonic integration and supports diverse network architectures. RTP has already shipped volume production of 100G/lane PICs for 400G-DR4 and 800G-DR8 deployments. In parallel, RTP is advancing 400G/lane technology based on intensity modulation direct detection (IMDD) and coherent-lite designs, while also demonstrating its co-packaged optics (CPO) platform. These developments are intended to future-proof the optical connectivity requirements of next-generation AI and cloud infrastructure.

RTP plans to showcase its silicon modulators operating at 400G/lane IMDD at the IEEE Silicon Photonics Conference in London on April 15, 2025. The company follows a fabless++ model with a fully optimized supply chain spanning foundries, testing, and packaging partners. It collaborates closely with leading electronic IC vendors to validate system performance and ensure interoperability.

Key Points:

• RTP releases 200G/lane PICs for 800G-DR4 and 1.6T-DR8; 800G-2xFR2 and 1.6T-2xFR4 coming in H2 2025.

• RAIN-200 platform includes silicon modulators, germanium photodetectors, and low-loss waveguides.

• Supports 1×8 laser splitting and advanced packaging for CPO applications.

• Volume shipments of 100G/lane PICs (400G-DR4, 800G-DR8) already underway.

• Demonstrating 400G/lane IMDD and coherent-lite designs at IEEE Silicon Photonics Conference 2025.

“Our RAIN-200 platform delivers the high bandwidth, low power, and scalability needed to address the optical connectivity demands of AI and hyperscale systems,” said Dr. Soo-Jin Chua, CEO of Rain Tree Photonics.

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