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Samsung Electro-Mechanics partners with AMD for substrates

Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates designed for hyperscale data center compute applications. These advanced substrates are produced at SEMCO’s technology hub in Busan and a newly constructed state-of-the-art factory in Vietnam. SEMCO has invested 1.9 trillion KRW (approximately $1.6 billion USD) in the new FCBGA factory, highlighting its dedication to enhancing substrate technology and manufacturing capabilities to meet the highest industry standards and future technological needs.

The partnership with AMD aims to address the challenges of integrating multiple semiconductor chips (chiplets) on a single large substrate. These substrates, crucial for CPU and GPU applications, provide larger surface areas and higher layer counts necessary for dense interconnections in advanced data centers. Compared to standard computer substrates, those used in data centers are ten times larger and feature three times more layers, ensuring efficient power delivery and signal integrity. SEMCO’s innovative manufacturing processes minimize warpage, ensuring high yields during chip mounting. The FCBGA factory is equipped with real-time data collection and modeling capabilities, allowing SEMCO to develop predictive manufacturing models that ensure the integrity of signal, power, and mechanical components, positioning SEMCO as a leader in next-generation data center substrates.

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