Sivers Semiconductors has secured $6 million in first-year funding from the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act. The funding, part of the Microelectronics Commons program, aims to fast-track domestic chip prototyping. Sivers will collaborate with major players, including Ericsson, Raytheon, MIT, Boston University, and Northeastern University, to advance key innovations in microelectronics and bolster the U.S.’s position in this strategic sector.
Sivers Semiconductors will spearhead a 5G/6G program focusing on beamformer IC and array designs targeting FR3 frequencies (7-15 GHz). These frequencies are crucial for future networks as they combine benefits from both sub-6GHz and millimeter-wave bands, enabling wider bandwidths and higher data rates. The project’s goal is to enhance mobile communications, IoT connectivity, and autonomous vehicle technologies, with potential funding renewals over three years.
• Award: $6M from NEMC Hub under the Microelectronics Commons program.
• Partners: Ericsson, Raytheon, MIT, Boston University, Northeastern University.
• Focus: 5G/6G beamformer ICs and array designs for FR3 frequencies (7-15 GHz).
• Applications: Mobile communications, IoT devices, autonomous vehicles.
• Duration: Potential for a three-year renewal.
“This initiative propels Sivers into the forefront of 5G/6G innovation,” said Vickram Vathulya, CEO of Sivers Semiconductors. “Our collaboration with partners such as Ericsson and Raytheon will allow us to develop relevant innovative technology and products with dual-use applications across commercial and defense sectors.”