Fujitsu has developed a digital still camera platform incorporating wireless USB chipset from Staccato Communications. The platform uses the world’s first single-chip all-CMOS, Multiband-OFDM Alliance (MBOA) –compliant PHY module based upon the Fujitsu 0.11 micron semiconductor process. It also includes Staccato’s MBOA MAC that provides rapid device discovery, fast stream establishment, QoS and efficient use of spare capacity in a decentralized architecture.
Staccato and Fujitsu are jointly demonstrating the system in the Wireless USB Community at the Intel Developer Forum (IDF) spring events this week in Tokyo, Taipei and Beijing.
Wireless USB is the first major application for ultrawideband, and this demonstration shows how close we are to delivering products,” said Rick Kornfeld, President and CEO, Staccato Communications.
http://www.staccatocommunications.com
- In December 2004, Staccato Communications, a start-up focused and wireless ultrawideband (USB) silicon, named Rick Kornfeld as president and CEO. Kornfeld most recently was vice president and general manager of Texas Instruments’ Wireless Center, where he was responsible for TI’s wireless chipset business.
- Also in December, Fujitsu Limited and Staccato Communications announced a partnership under which they will provide all-CMOS, single-chip wireless universal serial bus (USB) and ultra-wideband (UWB) solutions for the global marketplace. Fujitsu will offer its SoC/ASSP together with Staccato Communications’ UWB products as part of its next-generation wireless USB/UWB technology-based solutions to its customers.