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Texas Instruments Debuts Carrier Infrastructure Platform

Texas Instruments introduced new DSP-based carrier infrastructure platform designed for fixed and mobile communications applications. The new systems on chip (SOC), which is example in the second half of 2006, will be capable of delivering multimedia/3G services, such as fixed-mobile-convergence, within an IP multimedia services (IMS) environment.

TI’s new carrier infrastructure platform is comprised of three elements — silicon, software and reference designs that include evaluation modules.

The silicon architecture expands on that of the company’s previous VoIP infrastructure products, offering even higher solution density and the ability to support a greater breadth of applications, like video processing. The new processor is based on the company’s TMS320C64x+ core.

The second element of this platform includes the company’s widely-deployed Telogy voice software as well as a rich library of software modules designed to support the needs of fixed, mobile and cable network equipment manufacturers. These elements will address a variety of standards and technologies, including those features and functions required for Class 4 and Class 5 replacement, PacketCable 1.5, modem/fax transmission, wireless transcoding applications, wireless media gateways, wireless trunking, encryption, redundancy, diagnostics and service enhancements. TI is also working with key value-added third parties to offer complementary solutions.

The third element of this platform is a fully functional evaluation module.

http://www.ti.com/cis

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