Taiwan Semiconductor Manufacturing Company (TSMC) has announced an additional $100 billion investment in U.S. semiconductor manufacturing, bringing its total planned investment to $165 billion. The expansion includes three new fabrication plants, two advanced packaging facilities, and a major R&D center in Phoenix, Arizona. This marks the largest single foreign direct investment in U.S. history and aims to strengthen domestic semiconductor production for AI and other advanced applications.
TSMC expects this expansion to create 40,000 construction jobs over the next four years and generate tens of thousands of high-paying positions in chip manufacturing and R&D. Additionally, the project is projected to drive over $200 billion in indirect economic impact across the U.S. over the next decade. The Arizona fabs will support leading AI and tech companies, including Apple, NVIDIA, AMD, Broadcom, and Qualcomm, reinforcing America’s role in next-generation chip production.
TSMC’s Arizona site has been in volume production since late 2024, employing over 3,000 people on 1,100 acres. This investment also represents TSMC’s first U.S. advanced packaging facilities, completing a key part of the domestic AI supply chain. In addition to its new Phoenix operations, TSMC runs a fab in Camas, Washington, and design service centers in Austin, Texas, and San Jose, California.
• TSMC increases its U.S. semiconductor investment to $165 billion, adding three fabs, two packaging facilities, and an R&D center.
• 40,000 construction jobs and tens of thousands of high-tech positions expected from the expansion.
• $200 billion in projected indirect economic output across the U.S. over the next decade.
• Arizona fab in volume production since late 2024, with 3,000 employees.
• TSMC’s first U.S. advanced packaging investments will help complete the domestic AI supply chain.
• Supports leading AI and semiconductor companies, including Apple, NVIDIA, AMD, Broadcom, and Qualcomm.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the United States. This vision is now a reality,” said TSMC Chairman and CEO Dr. C.C. Wei. “AI is reshaping our daily lives and semiconductor technology is the foundation for new capabilities and applications. With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our U.S. semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion.”
