GlobalFoundries expanded its silicon-photonics design capability with the acquisition of InfiniLink, a Cairo-based startup specializing in high-speed connectivity silicon, including SerDes, optical transceiver chipsets, and monolithic photonics designs. The company...
GlobalFoundries (GF) completed its acquisition of Singapore-based Advanced Micro Foundry (AMF), positioning the company as the largest pure-play silicon photonics foundry by revenue. The deal expands GF’s global manufacturing footprint...
OIF released a new Implementation Agreement (IA) defining a 112 Gb/s Retimed Transmitter Linear Receiver (RTLR) electrical interface, advancing energy-efficient optical module design for AI and hyperscale datacenters. The OIF-EEI-112G-RTLR...
Accton/Edgecore, 1Finity, and Liqid Team Up on All-Photonic Datacenter Fabric for Wide-Area AI Scaling Accton/Edgecore, 1Finity (a Fujitsu company), and Liqid unveiled a joint all-photonic datacenter architecture at SC25 in...
Lessengers unveiled an immersion-cooled, detachable 800G Near-Packaged Optics (NPO) module directly integrated with Alphawave Semi’s AlphaCHIP1600-IO chiplet at SC25 in St. Louis. The live demonstration fully submerges both the optical...
NTT opened its annual R&D Forum in Tokyo with a sharp focus on optical quantum computing, AI, cybersecurity, and autonomous mobility under this year’s theme, “IOWN: Quantum Leap.” The company...
PicoJool emerged from stealth with $12 million in funding led by Playground Global, positioning the Palo Alto startup to introduce a new class of pixel-level photonics designed to close the...
Avicena introduced a new performance milestone for its microLED-based LightBundle optical interconnects at SuperCompute 2025, driving 4Gbps per lane at transmitter currents of just 100µA per LED. At this operating...
Researchers at the Joint Quantum Institute (JQI) have demonstrated a new class of photonic chips built from arrays of microring resonators that passively convert a telecom-band laser into red, green,...
Tower Semiconductor introduced a new 3D-IC foundry capability that integrates its Silicon Photonics (SiPho) and SiGe BiCMOS electronic IC (EIC) processes at the wafer level, positioning the company to support...
OIF has taken a major step toward redefining the electrical backbone of next-generation compute systems with the release of its Next Generation CEI-448G Framework Document. The new framework, introduced at...
Kyocera Corporation announced a successful demonstration of its Underwater Wireless Optical Communication (UWOC) technology, achieving short-range data transmission speeds of 5.2Gbps. The development ranks among the fastest fiberless underwater optical...
Scala Data Centers, in collaboration with Lightera and Nokia, has completed the first Latin American test of hollow core fiber (HCF) technology, achieving a 32% reduction in latency compared to...
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