Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Montage Technology has launched sampling of its latest PCIe® 6.x/CXL® 3.x Retimer, designated M88RT61632. Designed for high-bandwidth applications such as ...
Tag: Silicon
Intel marks first EUV light at Fab 34 in Ireland
Intel celebrated first light from a new extreme ultraviolet (EUV) lithography system at its Fab 34 site in Leixlip, Ireland. ...
Samsung and NAVER target semiconductors for hyperscale AI
Samsung Electronics and NAVER Corporation are collaborating on semiconductor solutions tailored for hyperscale artificial intelligence (AI) models. The partnership leverages Samsung’s ...
Marvell’s OCTEON 10 DPU paired with Nokia ReefShark 5G chip
Marvell is providing its OCTEON DPU technology to augment Nokia’s 5G “Powered by ReefShark” chipset processing portfolio for 5G radio ...
Analog Devices debuts Single-pair Power over Ethernet at 1 km
Analog Devices introduced the first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) chipsets.Potential SPoE ...
AMD’s 4th gen server CPUs pack up to 96 cores
AMD released the 4th Gen EPYC processors, code-named Genoa, boasting up to 96 cores in a single processor and aimed ...
Tektronix and BRIDG offer domestic semiconductor package testing
Tektronix announced a collaboration with BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and integrated circuit packaging. This ...
New Semiconductor Climate Consortium gets underway
More that 60 companies have come together to form a new Semiconductor Climate Consortium (SCC) to accelerate the ecosystem’s reduction ...
Marvell advances to 3nm with TSMC
Marvell's first 3nm silicon is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle. Marvell said ...
Google Cloud’s C3 VMs powered by Intel Xeon + IPU
Google Cloud introduced its Compute Engine C3 VMs powered by the 4th Gen Intel Xeon Scalable processor and Google’s custom ...
Summary of new U.S. multilateral controls on advanced semiconductors
The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced a set of updates to its export controls ...
Taiwan’s AIROHA ships XGS-PON chip
AIROHA, a subsidiary of Taiwan-based MediaTek,confirmed that is XGS-PON chips are now being used in customer premise equipment (CPE) by ...
Samsung updates roadmap, aims for 1.4nm nodes in 2027
At its annual Samsung Foundry Forum event in San Jose, California, Samsung Electronics outlined its goals to drive process nodes ...
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