DustPhotonics introduced two new additions to its silicon photonics portfolio—Tamar200 and Tamar. These Photonic Integrated Circuits (PICs) support 2xFR4 optical modules and are designed for high-performance, power-efficient operation across 1.6T and 800G transmission rates. The new chips mark the industry’s first merchant 1.6T-2xFR4 silicon photonics solution, reinforcing DustPhotonics’ leadership in merchant silicon for next-gen optical interconnects.
The Tamar200 supports two transmit channels of 800G-FR4 (200Gbps/lane), while the Tamar chip handles two 400G-FR4 (100Gbps/lane) links. Both are built using DustPhotonics’ low-loss Mach-Zehnder Modulator (MZM)technology and an integrated, athermal optical multiplexer, eliminating the need for thermoelectric cooling (TEC). The devices are designed for external lasers requiring just 40mW per wavelength, a key advantage in power-sensitive data center environments.
These compact PICs are optimized for OSFP and other high-density form factors and are compatible with retimed, LPO, and LRO applications for reaches up to 2km. By offering a reliable merchant alternative to EML-based designs, DustPhotonics aims to address ongoing supply chain challenges in the optical module market while scaling up bandwidth capabilities.
Samples of the new chips will be available later this month, and live demos are taking place at Booth #5321 during OFC in San Francisco.
• Tamar200: 1.6T-2xFR4 PIC (2x800G-FR4 @ 200Gbps/lane).
• Tamar: 2x400G-FR4 PIC operating at 100Gbps/lane.
• Integrated athermal mux and low-loss MZM eliminate need for TEC.
• Designed for external lasers (only 40mW per wavelength required).
• Compatible with retimed, LPO, and LRO designs; reach up to 2km.
• Compact footprint for OSFP and other high-density optical modules.
• Targeted at hyperscale data centers and AI cluster interconnects.
“We are excited to offer the first merchant 2xFR4 silicon photonics chip to the industry,” said Yoel Chetrit, CTO of DustPhotonics. “We believe these products will play a significant role in relieving some of the ongoing EML supply chain constraints in the industry.”
