Mixx Technologies, a start-up based in San Jose, California, announced its Advanced 3DS Platform, a next-generation optical interconnect architecture designed to address bandwidth bottlenecks in AI and high-performance computing (HPC) infrastructure. The platform combines intelligent orchestration, silicon-integrated optics, and high-speed interconnects to deliver real-time inference, large-scale AI training, and seamless integration with modern ASICs.
As AI workloads scale and strain existing interconnect frameworks, the Advanced 3DS Platform rethinks infrastructure with a unified approach to compute, memory, and networking. The platform is composed of three key components: the Engine, which orchestrates intelligent data movement; the Package, which enables close integration with XPU and ASIC designs; and the System, which transforms rack-scale compute with petabit-level connectivity. By leveraging silicon photonics, Mixx provides a non-blocking, energy-efficient fabric designed to overcome current and future data center interconnect limitations.
Mixx said its platform’s architecture supports multi-petabit interfaces and low-latency, high-throughput connections to deliver sustained performance for dynamic AI workloads. It offers flexibility for resource allocation, reliability through deep integration with silicon, and scalability aligned with industry standards.
• Platform includes Engine (intelligent orchestration), Package (XPU integration), and System (rack-scale architecture)
• Targets multi-petabit connectivity, real-time inference, and reduced network complexity
• Silicon-integrated optics enable high reliability and low power consumption for next-gen interconnects
• Founded by Vivek Raghuraman and Rebecca K. Schaevitz with experience at Broadcom, Intel, and Corning
• Headquartered in San Jose, with offices in India and Taiwan
“We are energizing the future of technology, building the foundation for the AI-driven world of tomorrow,” said Vivek Raghuraman, Co-Founder and CEO of Mixx Technologies. “Our goal is not just to build another product, but to fundamentally rethink AI interconnects. Our innovative Advanced 3DS Platform makes this possible by unlocking unprecedented performance and ensuring that AI workloads can scale beyond the limitations of today’s architecture.”
