Accelsius reported strong momentum in the first half of 2025, driven by a five-fold increase in data center deployments, international expansion, and an expanded product portfolio to address growing hyperscale and AI infrastructure demands. The Austin-based company, which specializes in two-phase, direct-to-chip liquid cooling, also gained recognition from the U.S. Department of Energy’s ARPA-E COOLERCHIPS program.
The company’s proprietary NeuCool platform demonstrated cooling capacity of up to 4,500W per GPU socket and successfully cooled a 250kW rack of AI servers while maintaining GPU temperatures below NVIDIA’s thermal throttle limits, even with facility water temperatures at 40°C. Accelsius says its approach allows facility water to operate 6–8°C higher than competing solutions, enabling over 25 percent energy savings and more free cooling hours. To strengthen enterprise reliability, Accelsius launched NeuGuard, a service and warranty program backed by CNA insurance, which provides up to $100,000 per rack coverage against internal leak-related damage.
Accelsius expanded into Canada and Europe through new partnerships. Deployments included a Thermal Simulation Rack at Global Switch’s London showroom and a second rack at Computacenter’s UK HyperScale Integration Center. The company partnered with Equinix to deploy its NeuCool IR80 system at the Equinix Co-Innovation Facility in Ashburn, Virginia, and announced a collaboration with Nordik Data Centers to build a next-generation AI facility near Montreal powered entirely by renewable energy.
- Five-fold increase in data center deployments in H1 2025
- NeuCool achieved 4,500W per GPU socket and cooled a 250kW AI rack
- Facility water operation at 6–8°C higher than competitors, saving 25% energy
- Selected for U.S. DOE ARPA-E COOLERCHIPS program with its MR250 CDU
- Expanded into European and Canadian markets with new partnerships
- Partnered with Equinix and Nordik Data Centers for AI and hyperscale projects
- Introduced NeuGuard reliability program with $100,000 per rack coverage
- Doubled product portfolio, including MR250 multi-rack CDU
“Our R&D team has prepared us for rapidly evolving chip and server architectures, such as 4,500W TDP sockets and vertically oriented blade servers,” said Dr. Richard Bonner, Accelsius’ chief technology officer.
🌐 Why it Matters: AI workloads are pushing rack densities toward 600kW, far beyond the limits of traditional cooling. Accelsius’ rapid growth and DOE validation underscore the urgency for high-performance, energy-efficient cooling solutions as hyperscale operators scale out next-generation infrastructure.
