Coherent has introduced its next-generation 2D VCSEL and photodiode arrays, targeting short-reach optical interconnects for AI-driven datacenters. Announced ahead of ECOC 2025 in Copenhagen, the new arrays are designed to replace copper links with compact, power-efficient optical connections, supporting the shift toward Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) architectures.
The platform builds on Coherent’s proven 100G PAM4 multimode VCSEL and PD technology, now scaled into a high-density 2D array (1.6 Tbps, 850 nm, 32x50G NRZ). The architecture enables an optimal degree of parallelism with advantages in power efficiency, latency reduction, and cost. These characteristics address the growing need for short-reach, high-bandwidth links in scale-up AI networks, where “slow and wide” connections are emerging as a critical complement to long-reach pluggables.
Coherent also disclosed plans to extend the platform with 1060 nm backside-emitting (BSE) flip-chip VCSEL/PD array variants in 2026. The expansion broadens the company’s optical interconnect portfolio as datacenters scale to meet the rising bandwidth demands of AI/ML workloads. The new arrays will be demonstrated at ECOC 2025, Booth C3124 in Copenhagen.
- 2D VCSEL/PD arrays support “slow and wide” short-reach optical interconnects
- High-density 1.6 Tbps 2D array (850 nm, 32x50G NRZ) architecture
- Enables copper link replacement with improved power, latency, and cost metrics
- Designed for NPO and CPO adoption in AI/ML datacenter networks
- 1060 nm BSE flip-chip array variants planned for 2026 product portfolio expansion
“Our high-density multimode 2D VCSEL and PD arrays represent an important step forward in enabling parallelism, power-efficient design, and flexible architectures that will shape the future of AI and machine learning networks,” said Karlheinz Gulden, Senior Vice President, Laser and Subsystems at Coherent.
🌐 Analysis
Coherent’s move underscores the growing importance of short-reach optical links optimized for AI clusters, where “slow and wide” designs offer energy and cost advantages over higher-speed serial links. The introduction of dense 2D arrays positions Coherent alongside other vendors racing to deliver components for NPO and CPO systems—an area gaining traction among hyperscalers seeking to reduce power bottlenecks. ECOC 2025 will serve as a key venue for testing industry alignment on these architectures as AI networking requirements accelerate.
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