• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 17, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Marvell Adds Active Copper Cable Equalizers

Marvell Adds Active Copper Cable Equalizers

October 14, 2025
in All
A A

Marvell Technology has introduced new active copper cable (ACC) linear equalizers to expand its connectivity portfolio for AI and data center applications. The launch addresses the growing bandwidth, thermal, and power challenges faced by hyperscale data centers as they scale AI workloads across increasingly dense infrastructure.

While copper remains the preferred medium for in-rack scale-up interconnects due to cost and simplicity, traditional direct attach copper (DAC) cables struggle to meet next-generation system demands for thinner cables and longer reach. Marvell’s new analog ACC devices integrate PAM4-based signal equalization, enabling longer distances with minimal latency and lower power consumption than digital active solutions.

Built on Marvell’s expertise in 100G/lane and 200G/lane analog technologies, the ACC linear equalizers extend reach and performance for 800G and 1.6T copper interconnects. They complement Marvell’s existing lineup of active electrical cable (AEC) and active optical cable (AOC) chipsets, rounding out the company’s full scale-up interconnect portfolio for AI infrastructure. The products are currently sampling to customers and are being showcased at the OCP Global Summit 2025 in San Jose.

• New analog ACC linear equalizers extend the reach of copper interconnects with minimal latency

• Support for 800G and 1.6T data rates using Marvell’s PAM4 signaling technology

• Complementary to Marvell’s AEC and AOC silicon portfolio for complete in-rack connectivity coverage

• Optimized for AI data center scale-up architectures demanding thinner, thermally efficient cabling

“Offering a full complement of ACC, AEC and AOC silicon technologies, Marvell is unique in the scale-up interconnect landscape, providing customers with a full range of solutions to meet their individual requirements,” said Xi Wang, senior vice president and general manager, Connectivity Business Unit at Marvell.

🌐  Analysis:

Marvell’s expansion into ACC linear equalizers reinforces its position as a key silicon provider for next-generation AI data center fabrics. By addressing in-rack copper limitations, Marvell competes directly with vendors like Broadcom, Astera Labs, and Credo, which are all advancing PAM4 and retimer-based solutions. The move also strengthens Marvell’s participation in OCP-aligned AI infrastructure, where power efficiency and modular interconnects are becoming critical design priorities.

🌐 We’re tracking the latest developments in networking silicon. Follow our ongoing coverage at: https://convergedigest.com/category/semiconductors/

Tags: MarvellOCPSummit25
ShareTweetShare
Previous Post

Oracle and NVIDIA Power Abu Dhabi’s US$3.5B Sovereign AI

Next Post

Vodafone Selects 1Finity for Major Open RAN Rollout Across Europe

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Open Compute Project Summit 2025: An Expanding Role in the AI Infrastructure Era
Video

Ciena Advances AI Infrastructure with 1.6T Coherent and Nubis Acquisition

October 20, 2025
Open Compute Project Summit 2025: An Expanding Role in the AI Infrastructure Era
Video

Lumentum: Optical Innovation Powers AI Infrastructure 

October 20, 2025
Open Compute Project Summit 2025: An Expanding Role in the AI Infrastructure Era
Video

Alan Weckel: Data Center Networks for the Petabit Era

October 20, 2025
OCP25: AMD Unveils “Helios” Open AI Rack Built on Meta’s Design
Data Centers

OCP25: AMD Unveils “Helios” Open AI Rack Built on Meta’s Design

October 19, 2025
#OCPSummit25: Shaping the Future of AI Data Centers
Video

#OCPSummit25: Shaping the Future of AI Data Centers

October 16, 2025
OCP Summit Keynote: Broadcom’s Ram Velaga Outlines ESUN
All

OCP Summit Keynote: Broadcom’s Ram Velaga Outlines ESUN

October 16, 2025
Next Post
Fujitsu, 1Finity, and Arrcus Target AI-Era Networks

Vodafone Selects 1Finity for Major Open RAN Rollout Across Europe

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version