TSMC has delivered a complete version of its 5 nanometer (nm) design infrastructure to design partners.
TSMC said its kit enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, especially for 5G and AI.
“TSMC’s 5-nanometer technology offers our customers the industry’s most advanced logic process to address the exponentially growing demand for computing power driven by AI and 5G,” said Cliff Hou, Vice President of Research & Development/Technology Development at TSMC. “5-nanometer technology requires deeper design-technology co-optimization. Therefore, we collaborate seamlessly with our ecosystem partners to ensure we deliver silicon-validated IP blocks and EDA tools ready for customer use. As always, we are committed to helping customers achieve first-time silicon success and faster time-to-market.”
TSMC’s 5nm process is already in risk production and offers IC designers a new level of performance and power optimization targeted at the next generation of high-end mobile and HPC applications.
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