ADVA Optical Networking announced its support and participation in the Directly Modulated Lasers on Silicon (DIMENSION) project, which aims to create a platform for single-chip electro-optical integration. The research involves lasers built with active III-V materials embedded into silicon photonics chips.
The four-year DIMENSION project is funded by the European Union’s Horizon 2020 research and innovation program and coordinated by Dresden University of Technology with participation from partners in Germany, Switzerland, Greece and the UK. The two research centers included are Innovations for High Performance Microelectronics and Athens Information Technology. The large industry partners are ADVA Optical Networking, Optocap and IBM Research – Zurich.
ADVA said the DIMENSION project could lead to cost-efficient components needed to optimize data center interconnect (DCI) transport and create the next generation of data centers.
“Improving efficiency in the DCI couldn’t be more vital given the increasing demand for cloud computing and the growing scale of the internet of things,”commented Michael Eiselt, director, advanced technology, ADVA Optical Networking. “Much of our recent innovation has centered on enhancing the DCI, such as our FSP 3000 CloudConnect™ solution. By integrating the three distinct technologies of silicon photonics, electronics and active photonics, we’re giving data centers what they need to meet tomorrow’s needs. It’s great to be working closely with other European companies and institutions to make this vital breakthrough a reality. It also provides fantastic opportunities for university students who get to be at the forefront of innovation and help make a significant impact on the industry.”
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