• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 10, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » #MWC22: Accelerating Virtual 5G Distributed Unit Processing

#MWC22: Accelerating Virtual 5G Distributed Unit Processing

February 27, 2022
in 5G / 6G / Wi-Fi, Semiconductors
A A

 What’s hot at #MWC22? In the drive toward O-RAN and v-RAN, silicon vendors are racing toward smaller geometries, and Marvell is on the leading edge with portfolio optimized for the RU, DU and now the virtualized DU, says Joel Brand, Senior Director, Product Marketing, Marvell. 

https://youtu.be/upKd1yp6YOM

The idea with the virtualized DU is to process some of the functionality in a host server leveraging cloud technologies and a new generation of accelerator cards powered by dedicated silicon.

Tags: #MWC22MarvellSilicon
ShareTweetShare
Previous Post

GSMA Foundry Telco Edge Cloud trial interconnects two MEC platforms

Next Post

Rakuten Symphony and Qualcomm target Massive MIMO RU and DU

Staff

Staff

Related Posts

Marvell Adds Active Copper Cable Equalizers
All

Marvell Adds Active Copper Cable Equalizers

October 14, 2025
Matt Murphy appointed Chair of Marvell’s Board
Optical

ECOC25: Marvell Highlights CPO, 800G COLORZ, and 1.6T PAM4 DSP

September 25, 2025
Matt Murphy appointed Chair of Marvell’s Board
Semiconductors

Marvell Expands Share Repurchase by $5B, CEO Outlines AI and Data Center Pipeline

September 24, 2025
Marvell pushes ahead to 2nm with TSMC
Semiconductors

Marvell Expands CXL with CPU and DRAM Interoperability

September 2, 2025
Matt Murphy appointed Chair of Marvell’s Board
Financials

Marvell Doubles Down on AI With Record $2B Quarter and Optical Milestones

August 28, 2025
Marvell Debuts 64 Gbps Bi-Directional Die-to-Die Interface in 2nm
All

Marvell Debuts 64 Gbps Bi-Directional Die-to-Die Interface in 2nm

August 26, 2025
Next Post
Rakuten Symphony and Qualcomm target Massive MIMO RU and DU

Rakuten Symphony and Qualcomm target Massive MIMO RU and DU

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version