Qualcomm announced its fifth generation “Gobi” embedded data connectivity reference platform for integrating LTE into a wide range of thin mobile devices, including laptops, tablets and convertibles.
Gobi now delivers LTE connectivity on FDD and TDD networks, with backwards compatibility to both HSPA+ and EV-DO networks. This will allow support for regional LTE frequencies with backwards compatibility to existing 2G/3G technologies. More specifically, this latest Gobi 4G LTE connectivity reference platform includes embedded GPS capability and features an application programming interface (API) with LTE extensions, which is compatible with leading connectivity standards, including CDMA2000® 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+, TD-SCDMA and LTE, with integrated backwards compatibility to HSPA and EV-DO. OS support includes Windows 8 and Android on multiple processing platforms, including Snapdragon dual-core and quad-core processors and x86 platforms.
Qualcomm said embedded modules based on the Gobi fifth generation reference platform will initially be available from Huawei, Novatel Wireless, Option, Sierra Wireless and ZTE in several form factors and regional configurations, making them a compelling 4G LTE solution for a variety of connected mobile devices.
“Mobile computing and broadband connectivity have already become indispensable tools in the road warrior’s arsenal,�? said Fram Akiki, senior director of product management for Qualcomm CDMA Technologies. “With Windows 8, we expect to see an increasing variety of mobile computing devices also in use by connected consumers around the world. Our Gobi fifth generation reference platform helps ensure that OEMs can develop products across their choice of operating systems and hardware platforms to meet the growing demand for mobile connectivity.”http://www.qualcomm.com
- In November 2011, Qualcomm has released its Gobi 4000 embedded modem chipsets for LTE. The Gobi 4000 platform, which represents the next generation of the company’s existing multimode 3G/4G wireless modems, allows mobile device manufacturers to offer both LTE/HSPA+ and LTE/EV-DO designs. The new silicon features the Gobi Application Programming Interface (API) with LTE extensions and is compatible with leading connectivity standards, including CDMA2000 1xEV-DO Rev. A and B, HSPA+, dual-carrier HSPA+, and LTE with integrated backwards compatibility to HSPA and EV-DO. Novatel Wireless and Sierra Wireless are offering modules.
