D2S, a design and software company based in San Jose, closed $9 million in Series B financing to further enhance and expand the market development for D2S’ design-for-e-beam (DFEB) technology, which allows semiconductor manufacturers to eliminate the barrier of rising mask costs and speed time to market.
As the industry moves to smaller geometries, mask costs become an even bigger challenge for IC manufacturers, making low-volume production of custom ICs economically infeasible. The company said its DFEB technology tackles this dilemma head on and enables leading-edge semiconductor systems-on-chips (SoCs) to be manufactured without the upfront mask cost. http://www.direct2silicon.com
