Qualcomm announced that multiple network operators have committed to trialing HSPA+ technology this year. Carriers expected to trial Qualcomm’s HSPA+ technology include Hutchison 3G, Telecom Italia, Telefonica and Telstra.
Qualcomm’s HSPA+ is a seamless upgrade from HSPA, delivering up to 28 Mbps mobile broadband and dramatic increases in network capacity without the need for new spectrum. The trials will use Qualcomm’s Mobile Data Modem (MDM) MDM8200 chipset. Key features being trialed include 64-QAM HSDPA for 21 Mbps downlink data rates and 2×2 downlink MIMO for 28 Mbps downlink data rates.
http://www.qualcomm.com
