Intel will offer a Nokia-developed HSDPA connectivity module to notebook manufacturers as part of its next-generation Intel Centrino Duo mobile technology platform. The companies said the HSDPA connectivity module will be widely available as an embedded option in a variety of notebooks.
In the connectivity module collaboration, Intel takes care of platform design, software, integration and support as well as sales and marketing. Nokia, for its part, brings the 3G HSDPA knowledge, leadership in connectivity products as well as carrier relationships. Nokia also manufactures the module.
“Notebook users are increasingly interested in wireless broadband access, and 3G offers a strong solution that is available today,” said Mooly Eden, vice president and general manager of Intel’s Mobile Platforms Group. “This module complements Intel’s Wi-Fi and WiMAX solutions to offer expanded connectivity options for notebook users.”http://www.nokia.comhttp://www.intel.com
