• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, April 29, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » TI Demonstrates Single-chip, Low Cost Cell phone

TI Demonstrates Single-chip, Low Cost Cell phone

August 7, 2005
in Uncategorized
A A

It is estimated that 80% of the world’s population now has wireless coverage, but that only about 20% can afford to subscribe to a wireless service due largely to the cost of mobile phones, according to the GSM Association. At a press event in New Delhi, Tom Engibous, Chairman of Texas Instruments, said his company will deliver a single-chip cell phone solution for ultra-low-cost handsets in emerging markets, such as India.

In India alone, roughly 11% of its total population has telecom connectivity with a mobile subscriber base of 58 million (source: Telecom Regulatory Authority of India, June 05).

“The mobile phone is already indispensable in established markets, and wireless will become even more useful in countries where today the availability of wired communication is limited,” said Engibous in his remarks to the press.

TI announced last December that it had delivered the industry’s first single-chip solution for mobile phones. Developed through TI’s 90nm CMOS manufacturing technology, the single-chip solution is now sampling.

The device initially targets GSM/GPRS handsets, but TI said it will offer single-chip cell phone solutions for additional air interfaces.

Also at the press event, Engibous announced the first cell phones built entirely in India, from concept to design to production.
http://www.ti.com/wirelesspressroom

Tags: AllSilicon
ShareTweetShare
Previous Post

Industry Reaction to FCC DSL Ruling

Next Post

UK's PlusNet Deploys Ellacoya's IP Switches

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

Charter Names Former AOL Access Business President as CEO

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version