At this week’s ECOC 2022 exhibition in Basel, Switzerland, OIF is hosting nearly 30 member companies in demonstrations in four critical areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.
400ZR Demo
OIF’s 400ZR project is proving successful in facilitating new and simplified architectures for high bandwidth inter-data center interconnects and promoting interoperability among coherent optical module manufacturers. This 400ZR interop demo shows a full implementation across an 80km DWDM ecosystem using multiple form-factor pluggable modules, 400GbE routers, a 75 GHz C-band open line system, and test equipment solutions from multiple vendors. The demo provides evidence of widescale 400ZR deployment readiness based on a broad ecosystem of interoperable solutions.
Co-Packaging Demo
While individual companies consider options to optimize power and density, OIF has seen the need to lead industry standardization discussions for co-packaging architectures that promise to reduce power consumption and increase bandwidth edge density. OIF is leading the industry’s interoperability discussions for co-packaging solutions and will showcase its progress with multi-party demonstrations of its 3.2T Module project and External Laser Small Form Factor Pluggable project (ELSFP). A variety of interoperable components that enable co-packaging will be shown, along with a system implementation.
Common Electrical I/O (CEI) Demo
OIF played a lead role in moving the industry to the next generation by developing electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability amongst 14 participating members prove the critical role OIF serves as well as the developing supplier ecosystem. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over various channels, including mated compliance boards, PCB channels, direct attach copper cable channels, a cabled backplane and even fiber. Each configuration demonstrates the technical viability of 112 Gbps operation, along with multiple industry form factors, including OSFP and QSFP-DD. The demo also shows a measured far-end eye diagram on an oscilloscope with analysis to show an example of the silicon signal integrity that is typically required going through the large variety of channels on display.
As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224 Gbps per lane, new specifications and technologies will be required. OIF, where the optical networking industry’s interoperability work gets done, is leading the charge on 224G hardware interconnection application spaces and definitions, unveiling publicly at ECOC the first live 224G demo.
Common Management Interface Specification (CMIS) Implementations Demo
CMIS is now established as the management interface of choice for next-generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined common mechanism to initialize and manage optical and copper modules while still providing the ability to support custom functionality. This commonality makes integration into different host platforms easier for both the host vendor and the module vendor. The CMIS demo consists of four separate demonstrations that show how modules can be managed and initialized, how modules can support multiple independent services (breakout) and how module firmware can be easily upgraded.
“The high level of participation in this year’s interoperability demonstration at ECOC demonstrates the global importance of OIF’s work and the collective efforts of its members to showcase how their solutions establish an ecosystem and work together to drive implementation of next-generation capabilities,” said Mike Klempa, Alphawave IP Group, and OIF Physical & Link Layer Interoperability Working Group Chair.
