Intel announced glass substrates for next-generation advanced packaging
The new material offers ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate.
Compared to organic substrates in use today, Intel’s glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling assembly of larger chiplet complexes. This allows more chiplests in a smaller footprint on one package. The ability of glass substrates to withstand high temperatures is also expected to provide chip architects with the flexibility to determine the design rules for power delivery and signal routing. This attribute enables the seamless integration of optical interconnects and embedding of inductors and capacitors into the glass during high-temperature processing.
Intel said it is on track to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the industry to continue advancing Moore’s Law beyond 2030.
“After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come,” stated Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development.
