Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt
Many optical components used in data centers, such as transceivers, incorporate free-space gaps in their designs. These gaps enable effective coupling from the laser to the Photonic Integrated Circuit (PIC) and from the PIC to the optical fiber, however, because liquids (including immersion liquids) have a different index of refraction than air, when a traditional optical component is immersed in fluid, the light path is significantly altered, rendering these devices effectively unusable for liquid cooling.
Dust Photonics’ transmit Carmel-8-IMC chip supports an optical assembly with no free-space optics. Inside the chip, lasers are butt-coupled to the PIC and the fiber is also attached directly to the PIC, thus enabling transceiver designs that can be used for both immersion and air cooling.
Ronnen Lovinger, CEO from Dust Photonics, explains:
– The application of immersion cooling for power management in next-generation data centers.
– Dust Photonics’ PICs are ready for integration into this cutting-edge transceivers for this immersion cooling application
– A live demonstration of their product in collaboration with Amphenol
Want to be involved our video series? Contact info@nextgeninfra.io
Dust Photonics raises US$24 million in Series B
Wednesday, February 21, 2024
DustPhotonics, a start-up based in Modi’in, Israel, raised US$24 million in Series B funding for its silicon photonics technology for data center and AI applications, The oversubscribed funding round was funded by a combination of prominent investors, including new and existing investors such as Sienna Venture Capital, Greenfield Partners, Atreides Management, and Exor Ventures.DustPhotonics said it plans to use the funding to scale production…
READ MORE
