Neoconix has begun shipping its latest board-to-board array connectors, the “Mini” (CBM) and SPH3 “Ultra,” powered by innovative C-Beam™ technology. These connectors are designed to support high-speed data rates of up to 112Gbps and are available in pitches of 0.5mm and 0.6mm.
Neoconix said its C-Beam technology, an enhancement of its PCBeam technology, is tailored for ultra-dense pitches down to 0.4mm and high-speed applications up to 112Gbps. It offers up to a 40% reduction in pitch compared to PCBeam, enabling high pin counts that combine numerous high-speed differential pairs, power, and signals in a single connector.
The Neoconix CBM “Mini” connector family features 84 and 128 position counts at 0.6mm and 0.5mm pitches respectively, all within a standard configuration smaller than a U.S, dime. The SPH3 “Ultra” connector family includes six offerings with three configurations (Large, Medium, and Small) across two pitches (0.5mm and 0.6mm), with pin counts ranging from 408 to 840 positions.
