Alphawave Semi has announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform, achieving an unprecedented memory bandwidth of 1.2 Terabytes per second (TBps) through chiplet-enabled technology.
In collaboration with Micron, channel simulations have demonstrated the platform’s exceptional performance, reaching 9.2 Gbps in an advanced 2.5D package across a complete HBM3E system. This system comprises the HBM3E IP subsystem, an innovative Alphawave Semi silicon interposer, and Micron’s HBM3E memory.
HBM3E has become the preferred memory choice for AI and HPC systems due to its high bandwidth, optimal latency, compact footprint, and excellent power efficiency. Alphawave Semi customers are deploying comprehensive HBM subsystem solutions that integrate the company’s HBM PHY with a versatile, JEDEC-compliant, highly configurable HBM controller, which can be fine-tuned to maximize efficiency for application-specific AI and HPC workloads.
Alphawave Semi has also developed an optimized silicon interposer design to achieve best-in-class results in signal integrity, power integrity, and thermal performance at 9.2 Gbps.
“Micron is committed to advancing memory performance through our comprehensive AI product portfolio as the demand for AI continues to grow in data centers,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “With their end-to-end channel simulations, we are pleased to see Alphawave Semi demonstrate a performance of 9.2 Gbps for AI accelerators with HBM3E. Together, we are empowering customers to accelerate system deployment with our Micron HBM3E solutions, delivering up to 30% lower power consumption compared to competitive offerings.”
“We are excited to lead the industry in delivering a complete 9.2 Gbps HBM3E PHY and controller chiplet-enabled platform achieving 1.2 TBps bandwidth, backed by channel simulations across the SoC, interposer, and Micron’s HBM3E memory,” said Mohit Gupta, senior vice president and general manager, Custom Silicon and IP, Alphawave Semi. “Leveraging this, along with our leading-edge custom silicon and advanced 2.5D/3D packaging capabilities, allows Alphawave Semi to provide a significant time-to-market advantage to our hyperscaler and data center infrastructure customers for their AI-enabled systems.”
