• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 10, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Intel Expands Defense Chip Production with $3 Billion in CHIPS Act Funding

Intel Expands Defense Chip Production with $3 Billion in CHIPS Act Funding

September 16, 2024
in Semiconductors
A A

Intel secured up to $3 billion in direct funding under the CHIPS and Science Act to support the Secure Enclave program, which aims to enhance trusted manufacturing of advanced semiconductors for U.S. government use. This new funding is part of the Biden-Harris Administration’s efforts to strengthen domestic chip production and security. Intel, which designs and manufactures leading-edge logic chips, will collaborate with the Department of Defense (DoD) to bolster the resilience of U.S. technological systems through secure, high-performance solutions.

The Secure Enclave program builds on previous collaborations between Intel and the DoD, such as the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP) projects. These initiatives have focused on securing the U.S. chip supply chain and advancing domestic microelectronics capabilities. Separate from this award, Intel had already secured funding earlier this year to modernize its commercial semiconductor fabrication facilities, further expanding its role in U.S. technological infrastructure.

Intel’s collaboration with the DoD includes delivering multi-chip package prototypes through the SHIP program and commercial foundry services for the RAMP-C initiative. The company is working with defense contractors such as Boeing and Northrop Grumman to develop and manufacture custom integrated circuits for critical defense systems. Intel’s 18A process technology, slated for production in 2025, is central to these efforts, ensuring secure, domestic production of advanced microelectronics.

• $3 billion awarded to Intel under the CHIPS and Science Act

• Intel collaborates with DoD through RAMP-C and SHIP programs

• Funding supports secure domestic manufacturing of advanced semiconductors

• Intel’s 18A technology expected to enter production in 2025

• Intel delivers multi-chip package prototypes and custom circuits for defense contractors

“Intel is proud of our ongoing collaboration with the U.S. Department of Defense to help strengthen America’s defense and national security systems,” said Chris George, president and general manager of Intel Federal.

Tags: CHIPs ActIntel
ShareTweetShare
Previous Post

Intel’s Pat Gelsinger Comments on Strategic Directions

Next Post

AWS Looks to Intel for AI Fabric Chip

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 
All

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 

October 23, 2025
Intel Ramps 18A Production at Fab 52
Semiconductors

Intel Ramps 18A Production at Fab 52

October 9, 2025
NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics
Semiconductors

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics

September 25, 2025
Intel Foundry Services forms USMAG Alliance
Semiconductors

NVIDIA and Intel Forge $5B Partnership to Build Data Center and PC Chips

September 18, 2025
Intel’s Q3 data center revenue dropped 27% yoy
Financials

Intel Names New Data Center, Client, and Foundry Leaders

September 8, 2025
Intel cites progress with U.S. fabs
Semiconductors

U.S. Takes 9.9% Stake in Intel with $8.9B Equity Investment

August 22, 2025
Next Post
Intel unveils Xeon 6 processors for HPC, AI, and Cloud Applications

AWS Looks to Intel for AI Fabric Chip

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version