At the ECOC24 Exhibition in Frankfurt, the following award winners and companies were announced:
Best Fibre/Fibre Component Product Award:
- Winner! Sumitomo Electric Europe Limited for 2C Z-PLUS Fiber ULL
- Teramount Ltd for TeraVERSE
- Formerica OptoElectronics Inc. for OSFP 800G, QSFP-DD 400Gb, and QSFP28 100Gb optical transceivers and sealed optical cables for immersion liquid cooling
Data Centre Innovation/Best Product Award:
- Winner! Coherent Corp for Coherent Datacenter Lightwave Cross-Connect (DLX™)
- Huawei for Huawei OptiXtrans DC908 Pro
- Ciena for Waveserver
- Cadence Design Systems for 224G Long-Reach (224G-LR) SerDes PHY IP
Most Innovative PON/5G/FTTx Product Award:
- Winner! China Mobile for 50G PON
- Infinera for x ICE-X 400G Single Fiber delivering High-Speed Business Services over existing PON
- Source Photonics for Source Photonics 200Gb/s PAM4-based 800G and 1.6T transceivers
Most Innovative Product: Most Innovative Hybrid PIC/Optical Integration Platform Award:
- Winner! Lightwave Logic Inc
- Avicena for µLED-based interconnect technology
- POET Technologies for POET Optical Interposer
Most Innovative Product: Most Innovative Photonic Component Award:
- Winner! NewPhotonics for NPG102 PIC Transmitter on Chip with integrated Optical Equalizer for LPO-based connectivity modules
- Coherent Corp
- Huawei for Huawei’s C+L Integrated WSS
Most Innovative Product: Most Innovative Pluggable Transceiver/Co-Packaged Module Award:
- Winner! Marvell for Marvell® COLORZ® 800 family
- Coherent for High Transmitter Optical Output Power, L-Band 800G coherent pluggable DCO module in QSFP-DD form factor
- Intel Corporation for Intel OCI optical I/O chiplet
Most Innovative Product: Most Innovative Test Equipment Award:
- Winner! Yokogawa for Yokogawa AQ6370E Optical Spectrum Analyzer
- EXFO for EXFO’s FTBx-88800 Series
- EXFO for OPAL-MD probe station for PIC testing
Optical Transport Award:
- Winner! Huawei for OptiXtrans E6600 series
- VIAVI Solutions for VIAVI Solutions ONE LabPro™ Testing Platform
- Precision Optical Technologies for Genesee™
Most Innovative Product: Most Innovative Chip-Scale Packaging/Optical Sub-Assembly Award:
- Winner! Nanoscribe GmbH & Co. KG for Nanoscribe’s Quantum X align
